Banks Eye $21 Billion of Bonds for Broadcom Chip-Financing Deal

Bloomberg

27 de outubro de 2026 às 17:09

Fato · trecho publicado por Bloomberg

Banks are planning to sell as much as about $21 billion of high-grade bonds as soon as early next year as part of a $63 billion funding package that Broadcom Inc. has pulled together to help finance chips for AI developer Anthropic PBC.

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